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Process Kits for the Semiconductor Industry












 

PKM Technology

C O M P O N E N T   C LE A N I N G
 
 


The consistency of recipe-driven, robotic control is extended to the final ultrasonic clean, rinse and dry process within our class 100 cleanroom. Standard cleaning recipes are developed to both optimize part cleanliness as well as maintain surface texture integrity based on the base material and surface finish of the component. Whenever possible, kit components are pre-assembled into subassemblies to speed and simplify the installation requirements at the customer fab. After final inspection, components are wrapped in semiconductor-grade aluminum foil, vacuum-packed, argon back-filled, double bagged and placed into a cleanroom compatible container for shipment to the customer.

 
Process Kit Component Cleaning
   

 

 

  
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