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Process Kits for the Semiconductor Industry





 

Process Kit Management

K I T T I N G		    
 


After final ultrasonic cleaning and drying, subassemblies are completed and final inspection is done in a class 100 cleanroom. Then, kit components are wrapped in semiconductor-grade aluminum foil, double-bagged and placed into a cleanroom-compatible container for shipment to the customer.

 A final inspection verifies that all of the correct components are present for each kit as they are paskaged in specially designed cleanroom-compatible containers that ship to the customer.
     

Tosoh SET process kits reduce installation time, which increases system uptime and wafer throughput. The graph below shows the wafer output increases, process by process, on two different PVD systems.
   
  Process Kit graph
 
Vectra IMP™ is a trademark or registered trademark of Applied Materials.

 

 

  
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